Ukusika i-Laser kuwubuchwepheshe obusebenzisa i-laser ukuhwamisa izinto, okuholela ekusikeni konqenqema.Ngenkathi ngokuvamile isetshenziselwa izicelo zokukhiqiza izimboni, manje isisetshenziswa izikole, amabhizinisi amancane, izakhiwo zezakhiwo, kanye nabathandi bezinto zokuzilibazisa.Ukusika i-laser kusebenza ngokuqondisa okukhiphayo kwelaser enamandla amakhulu ngokuvamile ngokusebenzisa i-optics.I-laser optics kanye ne-CNC (ukulawula izinombolo zekhompuyutha) zisetshenziselwa ukuqondisa ugongolo lwe-laser ezintweni.Ilaser yezentengiselwano yezinto zokusika isebenzisa isistimu yokulawula ukunyakaza ukulandela i-CNC noma i-G-code yephethini ezosikwa kumpahla.I-laser beam egxilile iqondiswe kokubalulekile, okuthi bese kuncibilika, kushiswe, kuhwamuke, noma kupheshulwe indiza yegesi,[1] kushiye unqenqema olunomphetho wekhwalithi ephezulu.
Umlando
Ngo-1965, umshini wokuqala wokusika we-laser wasetshenziselwa ukubhoboza izimbobo ku-diamond dies.Lo mshini wenziwe yi-Western Electric Engineering Research Centre.[3]Ngo-1967, abaseBrithani baba iphayona lokusika ijethi ye-oxygen ye-laser yezinsimbi.[4]Ekuqaleni kwawo-1970, lobu buchwepheshe bafakwa ekukhiqizeni ukuze kusike i-titanium ukuze kusetshenziswe i-aerospace.Ngesikhathi esifanayo amalaser e-CO2 ashintshwa ukuze asike okungezona izinsimbi, njengezindwangu, ngoba, ngaleso sikhathi, amalaser e-CO2 ayengenawo amandla anele okunqoba ukuguquguquka okushisayo kwezinsimbi.[5]
Inqubo
Ukusika kwensimbi yezimboni nge-laser enemiyalo yokusika ehlelwe ngesixhumi esibonakalayo se-CNC
I-Laser beam ngokuvamile igxile kusetshenziswa ilensi yekhwalithi ephezulu endaweni yokusebenza.Ikhwalithi ye-beam inomthelela oqondile kusayizi wendawo okugxilwe kuyo.Ingxenye encane ye-beam egxilile ngokuvamile ingaphansi kwamayintshi angu-0.0125 (0.32 mm) ububanzi.Kuye ngokujiya kwempahla, ububanzi be-kerf obuncane njengo-0.004 amayintshi (0.10 mm) bungenzeka.[6]Ukuze ukwazi ukuqala ukusika kusuka kwenye indawo ngaphandle konqenqema, ukubhoboza kwenziwa ngaphambi kokusika ngakunye.Ukubhoboza ngokuvamile kuhilela i-laser pulsed beam enamandla amakhulu okwenza kancane kancane imbobo kundaba, ithathe cishe amasekhondi angu-5–15 ngensimbi engagqwali engu-0.5-intshi (13 mm), isibonelo.
Imisebe yokukhanya okuhambisanayo evela emthonjeni we-laser ngokuvamile iwela kububanzi obuphakathi kwamayintshi angu-0.06–0.08 (1.5–2.0 mm) ububanzi.Le nsimbi ivamise ukugxila futhi iqiniswe ilensi noma isibuko endaweni encane kakhulu engamayintshi angu-0.001 (0.025 mm) ukuze kwakheke umsebe we-laser oqine kakhulu.Ukuze ufinyelele isiphetho esishelela kakhulu ngesikhathi sokusikwa kwekhonta, isiqondiso se-polarization kufanele sizungeziswe njengoba sizungeza umphetho wesiqeshana sokusebenza esikhonkolo.Ngokusikwa kwensimbi yeshidi, ubude obugxilwe buvamise ukuba amayintshi angu-1.5–3 (38–76 mm).[7]
Izinzuzo zokusika nge-laser ngaphezu kokusika okuwumshini zifaka ukubamba okulula kokusebenza kanye nokunciphisa ukungcoliswa kwe-workpiece (njengoba kungekho unqenqema lokusika olungangcoliswa yimpahla noma lungcolise impahla).Ukunemba kungase kube ngcono, njengoba ugongolo lwe-laser alugqoki ngesikhathi senqubo.Kuphinde kube nethuba elincishisiwe lokusonta okokusebenza okusikwayo, njengoba amasistimu e-laser anendawo encane ethinteke ekushiseni.[8]Ezinye izinto nazo zinzima kakhulu noma akunakwenzeka ukuzisika ngezindlela zendabuko.
Ukusika i-laser yezinsimbi kunezinzuzo ngaphezu kokusikwa kwe-plasma yokuba nembe kakhudlwana[9] nokusebenzisa amandla amancane lapho kusika insimbi yeshidi;Nokho, amalaser amaningi ezimboni awakwazi ukunqamula ukujiya okukhulu kwensimbi okungatholakala kuplasma.Imishini ye-laser emisha esebenza ngamandla aphakeme (ama-watts angu-6000, uma kuqhathaniswa nezilinganiso zangaphambili zemishini yokusika i-laser engu-1500) isondela emishinini ye-plasma ngokukwazi kwayo ukusika izinto eziwugqinsi, kodwa izindleko ezinkulu zemishini enjalo ziphezulu kakhulu kune-plasma. imishini yokusika ekwazi ukusika izinto eziwugqinsi njengepuleti lensimbi.[10]
Izinhlobo
4000 watt CO2 laser cutter
Kunezinhlobo ezintathu eziyinhloko zama-lasers asetshenziswa ekusikeni kwe-laser.I-CO2 laser ifanele ukusika, ukubhora, nokuqoshwa.Amalaser we-neodymium (Nd) kanye ne-neodymium yttrium-aluminium-garnet (Nd:YAG) ayafana ngesitayela futhi ahluka kuphela ekusebenzeni.I-Nd isetshenziselwa isicefe nalapho kudingeka khona amandla aphezulu kodwa ukuphindaphinda okuphansi.I-laser ye-Nd:YAG isetshenziswa lapho kudingeka khona amandla aphezulu kakhulu kanye nokubhora nokuqopha.Kokubili amalaser e-CO2 kanye ne-Nd/Nd:YAG angasetshenziselwa ukushisela.[11]
Amalaser e-CO2 avame "ukupompa" ngokudlula i-current ku-gas mix (DC-ejabulile) noma ngokusebenzisa amandla efrikhwensi yomsakazo (i-RF-ejabulile).Indlela ye-RF yintsha futhi isidume kakhulu.Njengoba imiklamo ye-DC idinga ama-electrode ngaphakathi komgodi, ingahlangabezana nokuguguleka kwe-electrode nokucwecwa kwezinto ze-electrode ku-glassware kanye ne-optics.Njengoba ama-resonator e-RF enama-electrode angaphandle awathambekele kulezo zinkinga.Amalaser e-CO2 asetshenziselwa ukusika izimboni zezinto eziningi ezihlanganisa i-titanium, insimbi engagqwali, insimbi emnene, i-aluminium, ipulasitiki, ukhuni, ukhuni lobunjiniyela, i-wax, izindwangu, nephepha.Amalaser e-YAG asetshenziswa ngokuyinhloko ukusika nokubhala izinsimbi nezitsha zobumba.[12]
Ngaphezu komthombo wamandla, uhlobo lokugeleza kwegesi lungathinta nokusebenza.Izinhlobonhlobo ezijwayelekile zamalaser e-CO2 zihlanganisa ukugeleza kwe-axial okusheshayo, ukugeleza kwe-axial okunensayo, ukugeleza okuphambene, kanye ne-slab.Ku-axial flow resonator esheshayo, ingxube ye-carbon dioxide, i-helium ne-nitrogen isakazwa ngesivinini esiphezulu nge-turbine noma i-blower.Ama-laser okugeleza aguquguqukayo azungeza ingxube yegesi ngesivinini esiphansi, edinga isiphephetha-moya esilula.Ama-slab noma ama-diffusion apholile ama-resonator anenkambu yegesi emile engadingi ukucindezela noma i-glassware, okuholela ekongeni kuma-turbines ashintshayo kanye ne-glassware.
Ijeneretha ye-laser ne-optics yangaphandle (kuhlanganise ne-focus lens) idinga ukupholisa.Kuye ngosayizi wesistimu nokucushwa, ukushisa kwemfucuza kungase kudluliselwe into epholile noma ngokuqondile emoyeni.Amanzi ayisipholisi esisetshenziswa kakhulu, esivamise ukuzuzwa nge-chiller noma isistimu yokudlulisa ukushisa.
i-laser microjet iyi-laser eqondiswa yijethi yamanzi lapho ugongolo lwe-laser oluthambile luhlanganiswa lube ijethi lamanzi elinengcindezi ephansi.Lokhu kusetshenziselwa ukwenza imisebenzi yokusika i-laser ngenkathi usebenzisa indiza yamanzi ukuze iqondise i-laser beam, efana ne-optical fibre, ngokusebenzisa ukuboniswa okuphelele kwangaphakathi.Izinzuzo zalokhu ukuthi amanzi abuye asuse imfucumfucu futhi apholise impahla.Izinzuzo ezengeziwe ngaphezu kokusika kwe-laser "eyomile" yendabuko isivinini sokudayela okuphezulu, i-parallel kerf, nokusika kwe-omnidirectional.[13]
Ama-laser we-fiber awuhlobo lwe-laser yesimo esiqinile ekhula ngokushesha embonini yokusika insimbi.Ngokungafani ne-CO2, ubuchwepheshe be-Fiber busebenzisa indlela yokuzuza eqinile, ngokuphambene negesi noma uketshezi.I-"seed laser" ikhiqiza i-laser beam bese ikhuliswa ngaphakathi kwe-glass fiber.Ngobude begagasi obungama-nanometers fiber lasers angu-1064 kuphela akhiqiza usayizi wendawo omncane kakhulu (ufika izikhathi eziyi-100 ezincane uma kuqhathaniswa ne-CO2) okwenza ilungele ukusika impahla yensimbi ekhanyayo.Lena enye yezinzuzo ezinkulu ze-Fiber uma iqhathaniswa ne-CO2.[14]
Izinzuzo ze-fiber laser cutter zihlanganisa: -
Izikhathi zokucubungula ezisheshayo.
Ukusetshenziswa kwamandla okuncishisiwe nezikweletu - ngenxa yokusebenza kahle kakhulu.
Ukuthembeka okukhulu nokusebenza - awekho ama-optics angalungiswa noma aqondaniswe futhi awekho amalambu angashintshwa.
Ukugcinwa okuncane.
Ikhono lokucubungula izinto ezibonakalayo ezifana nethusi nethusi
Ukukhiqiza okuphezulu - izindleko zokusebenza eziphansi zinikeza inzuzo enkulu ekutshaleni kwakho.[15]
Izindlela
Kunezindlela eziningi ezahlukene zokusika usebenzisa ama-lasers, anezinhlobo ezahlukene ezisetshenziselwa ukusika izinto ezahlukene.Ezinye zezindlela ziwukwenza umhwamuko, ukuncibilika nokushaywa, ukuncibilika nokushiswa, ukuqhekeka kwengcindezi eshisayo, ukubhala, ukusika okubandayo kanye nokushiswa kwe-laser okuzinzile.
Ukusika kwe-vaporization
Ekwenzeni ukuhwamuka ukusika i-beam egxilile ishisa ingaphezulu lempahla libe iphoyinti le-flashpoint futhi ikhiqize imbobo kakhiye.Imbobo kakhiye iholela ekwandeni okungazelelwe kokumuncwa ngokushesha kujule imbobo.Njengoba imbobo ijula futhi izinto zibilisa, umhwamuko ucekela phansi izindonga ezincibilikisiwe eziwukhiphayo bese ukhulisa imbobo.Izinto ezingancibiliki ezifana nokhuni, ikhabhoni kanye namapulasitiki e-thermoset ngokuvamile asikwa ngale ndlela.
Ncibilikisa futhi uphephethe
Ukuncibilikisa nokuvuthela noma ukusika okuhlanganisayo kusebenzisa igesi enomfutho ophezulu ukufuthela izinto ezincibilikisiwe endaweni yokusika, kwehlisa kakhulu isidingo samandla.Okokuqala impahla ishiselwa ifike endaweni yokuncibilika bese indiza yegesi iphephezela incibilikisiwe iphume ku-kerf igwema isidingo sokukhuphula izinga lokushisa lempahla ngokuqhubekayo.Izinto ezisikwa ngale nqubo ngokuvamile ziyizinsimbi.
Ukuqhekeka kokucindezeleka okushisayo
Izinto eziqinile zizwela kakhulu ekuqhekekeni okushisayo, isici esisetshenziswa ekuqhekekeni kokucindezeleka okushisayo.I-beam igxile endaweni ebangela ukushisa kwendawo kanye nokwanda kokushisa.Lokhu kubangela ukuqhekeka okungabe sekuholwa ngokuhambisa ugongolo.Umfantu unganyakaziswa ngokulandelana kwe-m/s.Ngokuvamile isetshenziselwa ukusika ingilazi.
Ukudayela okuyimfihlo kwama-wafers e-silicon
Olunye ulwazi: I-wafer dicing
Ukuhlukaniswa kwama-microelectronic chips njengoba kulungiselelwe ekwenziweni kwedivayisi ye-semiconductor kusuka kumawafa e-silicon kungenziwa yilokho okubizwa ngokuthi inqubo yokudayela okuyimfihlo, esebenza nge-pulsed Nd:YAG laser, ubude bayo (1064 nm) obujwayelane kahle ne-electronic. i-band gap ye-silicon (1.11 eV noma 1117 nm).
Ukusika okusebenzayo
Futhi kubizwa ngokuthi "ukushiswa kwegesi okuzinzile kwe-laser cutting", "ukusika amalangabi".Ukusika okusebenzayo kufana nokusika ithoshi ye-oxygen kodwa nge-laser beam njengomthombo wokuthungela.Ikakhulukazi isetshenziselwa ukusika i-carbon steel ngogqinsi olungaphezu kuka-1 mm.Le nqubo ingasetshenziswa ukusika amapuleti ensimbi aminyene kakhulu ngamandla amancane e-laser.
Ukubekezelela nokuqedwa kwengaphezulu
Abasiki be-laser banokuma okunemba kwama-micrometer angu-10 nokuphindaphinda kwama-micrometer angu-5.[catation needed]
Ubulukhuni obujwayelekile i-Rz bukhuphuka ngokujiya kweshidi, kodwa kuncipha ngamandla e-laser nesivinini sokusika.Lapho usika insimbi ye-carbon ephansi enamandla e-laser angu-800 W, ubuhwaqaqe obujwayelekile i-Rz bungu-10 μm ngogqinsi lweshidi elingu-1 mm, 20 μm ngo-3 mm, kanye no-25 μm ngo-6 mm.
{\displaystyle Rz={\frac {12.528\cdot S^{0.542}}{P^{0.528}\cdot V^{0.322}}}}{\displaystyle Rz={\frac {12.528\cdot S^{0.542} }}{P^{0.528}\cdot V^{0.322}}}}
Lapho: {\displaystyle S=}S= ukujiya kweshidi lensimbi ngo-mm;{\displaystyle P=}P= amandla e-laser ku-kW (abanye abasiki be-laser abasha banamandla e-laser angu-4 kW);{\displaystyle V=}V= isivinini sokusika ngamamitha ngomzuzu.[16]
Le nqubo iyakwazi ukubamba ukubekezelelana okuseduze kakhulu, ngokuvamile kuya ngaphakathi kweyintshi engu-0.001 (0.025 mm).Ingxenye yejometri kanye nomsindo womshini womshini kuhlobene kakhulu namandla okubekezelela.Ukuqedwa kwendawo okujwayelekile okubangelwa ukusikwa kwe-laser beam kungase kusuke ku-125 kuya ku-250 micro-intshi (0.003 mm kuya ku-0.006 mm).[11]
Ukucushwa komshini
I-dual-pallet flying optics laser
Ikhanda le-laser elindizayo
Ngokuvamile kukhona ukucushwa okuthathu okuhlukene kwemishini yokusika i-laser yezimboni: izinto ezihambayo, i-hybrid, nezinhlelo ze-optics endizayo.Lokhu kubhekisela endleleni i-laser beam enyakaziswa ngayo phezu kwezinto okufanele zisikwe noma zicutshungulwe.Kukho konke lokhu, ama-eksisi okunyakaza ngokuvamile aqokwa i-eksisi engu-X kanye ne-Y.Uma inhloko yokusika ingase ilawulwe, iqokwa njenge-axis engu-Z.
Ama-laser wezinto ezihambayo anenhloko yokusika enganyakazi futhi ahambise impahla ngaphansi kwayo.Le ndlela inikeza ibanga elingaguquki ukusuka kujeneretha ye-laser ukuya endaweni yokusebenza kanye nephuzu elilodwa lapho kuzokhishwa khona ukungcola okusikayo.Idinga ama-optics ambalwa, kodwa idinga ukuhambisa i-workpiece.Lo mshini wesitayela uvamise ukuba nama-optics okulethwa kwe-beam ambalwa kakhulu, kodwa futhi uvame ukuba kancane kakhulu.
Ama-laser ayi-Hybrid ahlinzeka ngetafula elihambayo ku-eksisi eyodwa (ngokuvamile i-X-eksisi) futhi linyakazise ikhanda ku-eksisi emfushane (Y).Lokhu kubangela ubude bendlela yokulethwa kwe-beam engaguquki kakhulu kunomshini obonayo endizayo futhi kungase kuvumele isistimu yokulethwa kwezingongolo olula.Lokhu kungase kubangele ukuncipha kokulahlekelwa kwamandla ohlelweni lokudiliva kanye nomthamo owengeziwe nge-watt ngayinye kunemishini ye-optics endizayo.
Amalaser e-Flying Optics afaka itafula elinganyakazi kanye nekhanda elisikwayo (elinogongolo lwe-laser) elihamba phezu kwendawo yokusebenza kuzo zombili izilinganiso ezivundlile.Abasiki be-optics endizayo bagcina isiqeshana sokusebenza simile ngesikhathi sokucutshungulwa futhi ngokuvamile asidingi ukubamba izinto ezibonakalayo.Isisindo esinyakazayo sihlala njalo, ngakho-ke ama-dynamics akuthintwa usayizi ohlukahlukene we-workpiece.Imishini yokubona endizayo iwuhlobo olushesha kakhulu, oluwusizo lapho usika izinto zokusebenza ezizacile.[17]
Imishini endizayo ye-optic kumele isebenzise indlela ethile ukuze icabangele ukushintsha kobude be-beam ukusuka endaweni eseduze (eduze ne-resonator) ukusika ukuya endaweni ekude (ekude ne-resonator) ukusika.Izindlela ezijwayelekile zokulawula lokhu zifaka phakathi ukungqubuzana, ukubona okuguquguqukayo noma ukusetshenziswa kwe-eksisi yobude obungashintshi.
Imishini ye-axis emihlanu kanye neyisithupha nayo ivumela ukusika ama-workpieces akhiwe.Ngaphezu kwalokho, kunezindlela ezahlukahlukene zokuqondisa ugongolo lwe-laser endaweni yokusebenza enomumo, ukugcina ibanga elifanele lokugxila kanye nokuma kwe-nozzle, njll.
Ukudonsa
Ama-laser ama-pulsed ahlinzeka ngokuqhuma kwamandla aphezulu isikhathi esifushane asebenza kakhulu kwezinye izinqubo zokusika i-laser, ikakhulukazi ukubhoboza, noma lapho kudingeka izimbobo ezincane kakhulu noma isivinini esiphansi kakhulu sokusika, ngoba uma kusetshenziswa ugongolo lwe-laser olungaguquki, ukushisa kwakungase kufinyelele ezingeni lokuncibilika lonke ucezu olusikwayo.
Ama-laser amaningi ezimboni anekhono lokushaya noma lokusika i-CW (igagasi eliqhubekayo) ngaphansi kokulawulwa kohlelo lwe-NC (ukulawula izinombolo).
Ama-laser we-pulse double asebenzisa uchungechunge lwama-pulse pair ukuze athuthukise izinga lokususwa kwezinto kanye nekhwalithi yembobo.Empeleni, ukushaya kwenhliziyo kokuqala kususa izinto endaweni futhi okwesibili kuvimbela i-ejecta ekunamatheleni ohlangothini lwembobo noma ukusikwa.[18]
Isikhathi sokuthumela: Jun-16-2022